LOW THERMAL RESISTIVITY, READY-MIX GROUT
BluCem RMX EA55 creates low exothermic heat during hydration through its use of slower reacting cements and specially selected thermally conductive aggregates. This allows the product to remain cool during placement of large pours and also allows the grout to effectively transmit heat during service life. Being fully shrinkage compensated and low exothermic heat generating makes BluCem Non-Shrink Deep Pour Grout suitable for a range of deep pour applications where low heat is necessary to protect surrounding services and minimise thermal shrinkage.
DEEP POUR ENGINEERED GROUT
BluCem LH60 has been designed to produce low heat of hydration for reinstatement of large structural sections of concrete or smaller sections with access difficulties. The high fluidity of BluCem LH60 reduces the need for compaction vibration even in restricted spaces. The low electrical resistivity of the product makes it ideal for applications of electro-chemical repair.
FLUID NON-SHRINK CONSTRUCTION GROUT
BluCem HS60 is a pumpable, non-shrink product which incorporates specially graded aggregates and advanced cement additives to form a cementitious grout. BluCem HS60 is Class C dual shrinkage compensated, high strength, low permeability and suitable for 100-year design life applications.
HYDROPHILIC POLYURETHANE INJECTION RESIN
BluRez CS150 is designed for the sealing/grouting and elastic connection of fissures and cavities in buildings and other structures constructed of concrete, brickwork and natural stone. Uses include tunnel linings, concrete foundations, subterranean curtains, retaining walls, slab on ground and bridge abutments.
CONSTRUCTION GROUT
BluCem GP60 has been designed as a high strength, low permeability general purpose grout for filling voids that can be dry packed, trowelled, poured or pumped. BluCem GP60 incorporates a gaseous expansion system to compensate for plastic shrinkage and settlement making it suitable for use over a large range of application consistencies and temperatures.